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| 2SK4013 TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (-MOS) 2SK4013 Switching Regulator Applications * * * * Low drain-source ON resistance: RDS (ON) = 1.35 (typ.) High forward transfer admittance: |Yfs| = 5.0 S (typ.) Low leakage current: IDSS = 100 A (max) (VDS = 640 V) Enhancement-model: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA) Unit: mm Absolute Maximum Ratings (Ta = 25C) Characteristics Drain-source voltage Drain-gate voltage (RGS = 20 k) Gate-source voltage Drain current DC Pulse (Note 1) (Note 1) Symbol VDSS VDGR VGSS ID IDP PD EAR IAR EAR Tch Tstg Rating 800 800 30 6 18 45 317 6 4.5 150 -55~150 Unit V V V A W mJ A mJ C C 1: Gate 2: Drain 3: Source Drain power dissipation (Tc = 25C) Single pulse avalanche energy (Note 2) Avalanche current Repetitive avalanche energy (Note 3) Channel temperature Storage temperature range JEDEC JEITA TOSHIBA SC-67 2-10U1B Weight: 1.7 g (typ.) Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics 2 Characteristics Thermal resistance, channel to case Thermal resistance, channel to ambient Symbol Rth (ch-c) Rth (ch-a) Max 2.78 62.5 Unit C/W C/W 1 Note 1: Please use devices on condition that the channel temperature is below 150C. Note 2: VDD = 90 V, Tch = 25C (initial), L = 14.5 mH, RG = 25 , IAR = 6 A Note 3: Repetitive rating; pulse width limited by maximum channel temperature. This transistor is an electrostatic sensitive device. Please handle with caution. 3 1 2006-11-13 2SK4013 Electrical Characteristics (Ta = 25C) Characteristics Gate leakage current Drain-source breakdown voltage Drain cut-OFF current Drain-source breakdown voltage Gate threshold voltage Drain-source ON resistance Forward transfer admittance Input capacitance Reverse transfer capacitance Output capacitance Rise time Symbol IGSS V (BR) GSS IDSS V (BR) DSS Vth RDS (ON) Yfs Ciss Crss Coss tr ID = 3 A VDS = 25 V, VGS = 0 V, f = 1 MHz Test Condition VGS = 25 V, VDS = 0 V IG = 10 A, VDS = 0 V VDS = 640 V, VGS = 0 V ID = 10 mA, VGS = 0 V VDS = 10 V, ID = 1 mA VGS = 10 V, ID = 3 A VDS = 20 V, ID = 3 A Min 30 800 2.0 2.5 Typ. 1.35 5.0 1400 30 130 25 Max 10 100 4.0 1.7 pF Unit A V A V V S 10 V VGS 0V 50 RL= 133 VDD 400 V - VOUT ns Turn-ON time Switching time Fall time ton 80 tf Duty < 1%, tw = 10 s = 65 nC Turn-OFF time Total gate charge (gate-source plus gate-drain) Gate-source charge Gate-drain ("miller") charge toff Qg Qgs Qgd VDD 400 V, VGS = 10 V, ID = 6 A - 220 45 25 20 Source-Drain Ratings and Characteristics (Ta = 25C) Characteristics Continuous drain reverse current (Note 1) Pulse drain reverse current Forward voltage (diode) Reverse recovery time Reverse recovery charge (Note 1) Symbol IDR IDRP VDSF trr Qrr Test Condition IDR = 6 A, VGS = 0 V IDR = 6 A, VGS = 0 V, dIDR/dt = 100 A/s Min Typ. 1100 10 Max 6 18 -1.7 Unit A A V ns C Marking K4013 Part No. (or abbreviation code) Lot No. A line indicates lead (Pb)-free package or lead (Pb)-free finish. 2 2006-11-13 2SK4013 5 ID - VDS COMMON SOURCE Common source Tc = 25C Tc 25C PULSE TEST Pulse test 8,10 6 5.5 10 5.5 ID - VDS Common 8,10 source Ta=25 Pulse test 6 DRAIN CURRENT ID (A) DRAIN CURRENT ID (A) 4 8 5.25 5.75 5.5 3 5.25 5 6 2 5 4 5.25 5 1 VGS=4.5V 0 0 2 4 6 DRAIN-SOURCE VOLTAGE 2 VGS=4.5V 0 10 VDS 8 (V) 0 10 20 30 40 50 DRAIN-SOURCE VOLTAGE VDS (V) 16 Common source V DS=20V Pulse test 12 ID - VGS DRAIN-SOURCE VOLTAGE VDS (V) 10 VDS - VGS COMMON SOURCE Tc Common source = 25C PULSETa=25 TEST DRAIN CURRENT ID (A) 8 Pulse test 6 6 4 8 4 Tc = 100C Ta=100 -55 25 2 3 ID = 1.5 A 0 0 2 4 6 8 (V) 0 10 0 4 8 12 16 20 GATE-SOURCE VOLTAGE VGS GATE-SOURCE VOLTAGE VGS (V) 100 FORWARD TRANSFER ADMITTANCE Yfs (S) Yfs - ID DRAIN-SOURCE ON RESISTANCE RDS (ON) () RDS (ON) - ID 10.00 Common source V GS=10V Tc=25 Pulse test Common source V DS=20V Pulse test 10 -55 Tc = 100C Ta=100 25 1.00 1 0.1 0.1 1 10 DRAIN CURRENT ID (A) 100 0.10 0.01 0.1 1 DRAIN CURRENT ID (A) 10 3 2006-11-13 2SK4013 5 DRAIN-SOURCE ON RESISTANCE RDS (ON) () RDS (ON) - Tc DRAIN REVERSE CURRENT IDR (A) 10 Common source Tc=25 Pulse test IDR - VDS 4 Common source V GS=10V Pulse test 7 3 6 3 1 2 ID=1.5A 1 3 10 VGS=0-1V 1 0 -80 -40 0 40 80 120 CASE TEMPERATURE Tc (C) 160 0.1 0 -0.2 -0.4 -0.6 -0.8 -1 -1.2 DRAIN-SOURCE VOLTAGE VDS (V) 10000 C - VDS Vth (V) 5 Vth - Tc Ciss (pF) 4 1000 Coss GATE THRESHOLD VOLTAGE CAPACITANCE C 3 2 Common source V DS=10V ID=1mA Pulse test -80 -40 0 40 80 CASE TEMPERATURE Tc (C) 120 160 100 Common source V GS=0V f=1MHz Tc=25 10 0.1 1 10 DRAIN-SOURCE VOLTAGE VDS (V) 100 Crss 1 0 PD - Tc 60 DYNAMIC INPUT/OUTPUT CHARACTERISTICS 450 DRAIN-SOURCE VOLTAGE VDS (V) DRAIN POWER DISSIPATIOND P (W) 40 200 300 100 VDS = 400 V 10 20 150 VGS 5 0 0 40 80 CASE TEMPERATURE Tc () 120 160 0 0 20 40 60 80 0 100 TOTAL GATE CHARGE Qg (nC) 4 2006-11-13 GATE-SOURCE VOLTAGE VGS (V) VDS Common source ID = 6 A Tc = 25C Pulse test 15 2SK4013 rth - tw 10 NORMALIZED TRANSIENT THERMAL IMPEDANCE rth (t)/Rth (ch-c) 1 Duty=0.5 0.2 0.1 0.1 0.05 0.02 PDM t 0.01 0.01 SINGLE PULSE T Duty = t/T Rth (ch-c) = 2.78C/W 10 100 1 10 0.001 10 100 1 PULSE WIDTH tw (s) SAFE OPERATING AREA 100 400 350 EAS - Tch DRAIN CURRENT ID (A) 10 ID max (CONTINUOUS) * 1 ms * 1 DC OPERATION Tc = 25C 100 s * AVALANCHE ENERGY E AS (mJ) AVALANCHE ENERGY E (mJ) AS ID max (PULSE) * 300 250 200 150 100 50 0 25 cH CHANNEL TEMPERATURE (INITIAL) Tch (C) 50 75 100 CHANNEL TEMPERATURE (INITIAL) T 125 () 150 0.1 *: SINGLE NONPETITIVE PULSE Tc = 25C Curves must be derated linearly with 0.01 1 increase in temperature VDSS max 1000 10000 10 100 DRAIN-SOURCE VOLTAGE VDS I V 15 V -15 V VDD TEST CIRCUIT RG = 25 VDD = 90 V, L = 14.5 mH BVDSS IAR VDS WAVE FORM AS = 1 B VDSS L I2 B 2 VDSS - VDD 5 2006-11-13 2SK4013 RESTRICTIONS ON PRODUCT USE * The information contained herein is subject to change without notice. 20070701-EN * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 6 2006-11-13 |
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